Abstract
A silver palladium (Ag/Pd) alloy powder is used as an example material to illustrate potential applications of electrophoretic deposition (EPD) in electronics manufacturing, in particular the forming of multilayer devices. The dispersion and deposition of the Ag/Pd powder in acetic acid is characterized. It is found that deposition can be explained by the direct action of electrostatic force on individual particles. Depositions of this Ag/Pd powder are then used to demonstrate: forming of a continuous layer on a rigid substrate; forming of continuous layers in laminated and sintered BaTiO3 multilayers; and incorporation of patterned depositions into a multilayer by either overcasting the patterned deposition with a particulate slip to form a multicomponent tape, or direct lamination of the patterned deposition to a low temperature co-fired ceramic (LTCC) tape. It is shown that electrically conducting layers can be formed at an average thickness of only two times the diameter of the starting powder. Continuous conductor lines thirty times the average diameter of the starting powder were formed.
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van Tassel, J., Randall, C.A. Potential for integration of electrophoretic deposition into electronic device manufacture; demonstrations using silver/palladium. Journal of Materials Science 39, 867–879 (2004). https://doi.org/10.1023/B:JMSC.0000012916.92366.48
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DOI: https://doi.org/10.1023/B:JMSC.0000012916.92366.48