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Thin film fracture: Ti-coating-Be-substrate bond failure

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Abstract

The role of microstructure in the fracture of the bond between vapour-deposited thin film coatings and substrates will be modelled to a first approximation using classical fracture mechanics principles. Vapour-deposited coatings are composed of a grain structure with varying orientations. The effect of differing degrees of texture on the bond strength between the coating and its substrate will be considered in this analysis. Incorporated in stress calculations will be the residual stresses arising from the thermal contraction of the coating, an applied tensile stress normal to the coating surface (as that in an adherence pull test) and the critical stress needed for coating-substrate bond failure.

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  1. Rockwell International, North American Space Operations, PO Box 464, 80402-0464, Golden, Colorado, USA

    A. F. Jankowski

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  1. A. F. Jankowski
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Jankowski, A.F. Thin film fracture: Ti-coating-Be-substrate bond failure. J Mater Sci 22, 346–350 (1987). https://doi.org/10.1007/BF01160591

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  • DOI: https://doi.org/10.1007/BF01160591

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