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Large-Area Synthesis of High-Quality and Uniform Graphene Films on Copper Foils

Science
7 May 2009
Vol 324, Issue 5932
pp. 1312-1314

Growing Graphene

The highest quality graphene samples, single-atom-thick layers of carbon, are suspended flakes exfoliated from graphite, but these samples are very small in size (square micrometers). For many electronics applications, larger areas are needed. Li et al. (p. 1312, published online 7 May) show that graphene grows in a self-limiting way on copper films as large-area sheets (one square centimeter) from methane through a chemical vapor deposition process. The films, which are mainly one layer in thickness, can be transferred to other substrates and have electron mobilities as high as 4300 square centimeters per volt second.

Abstract

Graphene has been attracting great interest because of its distinctive band structure and physical properties. Today, graphene is limited to small sizes because it is produced mostly by exfoliating graphite. We grew large-area graphene films of the order of centimeters on copper substrates by chemical vapor deposition using methane. The films are predominantly single-layer graphene, with a small percentage (less than 5%) of the area having few layers, and are continuous across copper surface steps and grain boundaries. The low solubility of carbon in copper appears to help make this growth process self-limiting. We also developed graphene film transfer processes to arbitrary substrates, and dual-gated field-effect transistors fabricated on silicon/silicon dioxide substrates showed electron mobilities as high as 4050 square centimeters per volt per second at room temperature.

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Published In

Science
Volume 324 | Issue 5932
5 June 2009

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Submission history

Received: 22 January 2009
Accepted: 9 April 2009
Published in print: 5 June 2009

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Acknowledgments

We thank the Nanoelectronic Research Initiative (NRI–Southwest Area Nanoelectronics Center, grant no. 2006-NE-1464), the Defense Advanced Research Projects Agency Carbon Electronics for RF Applications Center, and the University of Texas at Austin for support.

Authors

Affiliations

Xuesong Li
Department of Mechanical Engineering and the Texas Materials Institute, 1 University Station C2200, The University of Texas at Austin, Austin, TX 78712–0292, USA.
Weiwei Cai
Department of Mechanical Engineering and the Texas Materials Institute, 1 University Station C2200, The University of Texas at Austin, Austin, TX 78712–0292, USA.
Jinho An
Department of Mechanical Engineering and the Texas Materials Institute, 1 University Station C2200, The University of Texas at Austin, Austin, TX 78712–0292, USA.
Seyoung Kim
Department of Electrical and Computer Engineering, Microelectronics Research Center, The University of Texas at Austin, Austin, TX 78758, USA.
Junghyo Nah
Department of Electrical and Computer Engineering, Microelectronics Research Center, The University of Texas at Austin, Austin, TX 78758, USA.
Dongxing Yang
Department of Mechanical Engineering and the Texas Materials Institute, 1 University Station C2200, The University of Texas at Austin, Austin, TX 78712–0292, USA.
Richard Piner
Department of Mechanical Engineering and the Texas Materials Institute, 1 University Station C2200, The University of Texas at Austin, Austin, TX 78712–0292, USA.
Aruna Velamakanni
Department of Mechanical Engineering and the Texas Materials Institute, 1 University Station C2200, The University of Texas at Austin, Austin, TX 78712–0292, USA.
Inhwa Jung
Department of Mechanical Engineering and the Texas Materials Institute, 1 University Station C2200, The University of Texas at Austin, Austin, TX 78712–0292, USA.
Emanuel Tutuc
Department of Electrical and Computer Engineering, Microelectronics Research Center, The University of Texas at Austin, Austin, TX 78758, USA.
Sanjay K. Banerjee
Department of Electrical and Computer Engineering, Microelectronics Research Center, The University of Texas at Austin, Austin, TX 78758, USA.
Luigi Colombo* [email protected]
Texas Instruments, Dallas, TX 75243, USA.
Rodney S. Ruoff* [email protected]
Department of Mechanical Engineering and the Texas Materials Institute, 1 University Station C2200, The University of Texas at Austin, Austin, TX 78712–0292, USA.

Notes

*
To whom correspondence should be addressed. E-mail: [email protected] (L.C.); [email protected] (R.S.R.)

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